Technology Track G: Seminar on Medical Bonding and Welding Technology

Technology Track G: Seminar on Medical Bonding and Welding Technology

Afternoon of Sep 25, 2019 | Conference Room B, Hall 2 of SWEECC

Conference Background

Welding and adhesive with full face combination, can achieve effective sealing and leakage protection, prevent and dismantling, use less parts, can better ensure the safety and consistency of medical devices, especially for micro size medical products. At the same time, in orthopaedics, dentistry and other fields, adhesion technology is directly used in the treatment as a solution in clinical application to reduce the pain of patients.
With the development of medical technology, as well as the development and application of adhesion and welding technology, users are faced with many puzzles about how to choose and use adhesion and welding technology, such as: how to choose the right adhesion or welding technology? Is it possible to ensure a reliable connection between two different materials? How reliable is the bonding or welding? What is the cause of the connection failure when it occurs?
In response to the hot demand of medical device industry, Medtec will first launch the seminar on medical bonding and welding technology to discuss the innovative application and confusion of bonding and welding technology in medical industry.

Conference Content

Who Should Attend?

R&D, Design and Technology Department, Project Manager/Director and Managing Director from electronic medical devices manufacturers
Sensor and medical power suppliers and service providers
Other medical electronic components and processing equipment suppliers

*Conference agenda updates according to speaker confirming.

Agenda

Speaker

Coming soon

Sponsor package

Registration

Transportation

Conference Room of Shanghai World Expo Exhibition & Convention Center

North Entrance, No. 850 Bocheng Rd. Shanghai