中国国际医疗器械设计与制造技术展览会(Medtec China)2018

Dedicated to design & manufacturing for medical device

25-27 September 2019 | Shanghai,China

Technology Track G: Seminar on Medical Bonding and Welding Technology

Introduction

Agenda

Speaker

Sponsor/Package

Registration

Transportation

Technology Track G: Seminar on Medical Bonding and Welding Technology

Afternoon of Sep 25, 2019 | Conference Room B, Hall 2 of SWEEC

Introduction 

Conference Background

  • Welding and adhesive with full face combination, can achieve effective sealing and leakage protection, prevent and dismantling, use less parts, can better ensure the safety and consistency of medical devices, especially for micro size medical products. At the same time, in orthopaedics, dentistry and other fields, adhesion technology is directly used in the treatment as a solution in clinical application to reduce the pain of patients.
  • With the development of medical technology, as well as the development and application of adhesion and welding technology, users are faced with many puzzles about how to choose and use adhesion and welding technology, such as: how to choose the right adhesion or welding technology? Is it possible to ensure a reliable connection between two different materials? How reliable is the bonding or welding? What is the cause of the connection failure when it occurs?
  • In response to the hot demand of medical device industry, Medtec will first launch the seminar on medical bonding and welding technology to discuss the innovative application and confusion of bonding and welding technology in medical industry.

Conference Content

  • Application, regulation standard and development trend of medial bonding and welding technology
  • Common problems in medical plastic welding
  • Comparison and Selection of Leak Detection Methods in Medical Device Production Process.
  • Innovative adhesive solution for medical products
  • Selection and application of medical adhesive

Who Should Attend?

  • R&D, Design and Technology Department, Project Manager/Director and Managing Director from electronic medical devices manufacturers
  • Sensor and medical power suppliers and service providers
  • Other medical electronic components and processing equipment suppliers

*Conference agenda updates according to speaker confirming.

 Agenda

>> Download

 Speaker
  • Ke Chen, Associate Professor, Doctoral Supervisor, School of Materials Science and Engineering, Shanghai Jiao Tong University
  • David Fang, Medical Industry Manager, Branson Ultrasonics(Shanghai) Co., Ltd
  • Bruce Li, Medical Industry Manager, ATEQ CHINA CO.,LTD
  • Dr. –Ing. Jian-Yi Shao , Managing Director, Hoenle UV Technology (Shanghai) Trading Co.,Ltd
 Sponsor package

 

 Registration

>>Register now

 Transportation

Conference Room of Shanghai World Expo Exhibition & Convention Center

North Entrance, No. 850 Bocheng Rd. Shanghai

Hotel Reservation 

Speech & Cooperation

Carina Li

T:+86-10-5730 6163

E:carina.li@ubm.com

Sponsor & Paid Conference

Julia Zhu

+86-21 6157 3922

E:julia.zhu@ubm.com

Media & Free Conference

Sophia XU

T:+86-10-5730 6095

E:Sophia.xu@ubm.com